Microelectronics

Elevate your microelectronics manufacturing with cutting-edge production equipment from ONBoard Solutions. Discover specialized systems built for precision, reliability, and advanced assembly.

F&S Bondtec Series 86 Battery Bonding System

F&S Bondtec Series 86 Battery Bonding System

FS BONDTEC 5380 DIE Bonder

FS BONDTEC 5380 DIE Bonder

FS BONDTEC 5600iC Pull & Shear Tester

FS BONDTEC 5600iC Pull & Shear Tester

FS BONDTEC Series 5630 Thin Wire Wedge-Wedge

FS BONDTEC Series 5630 Thin Wire Wedge-Wedge

FS BONDTEC Series 5650 Heavy Ribbon Bondhead

FS BONDTEC Series 5650 Heavy Ribbon Bondhead

FS BONDTEC Series 5650 Heavy Wire Bondhead

FS BONDTEC Series 5650 Heavy Wire Bondhead

FS BONDTEC Series 5830 Thin Wire Wedge-Wedge

FS BONDTEC Series 5830 Thin Wire Wedge-Wedge

FS BONDTEC Series 5832 Thin Wire Deep Access

FS BONDTEC Series 5832 Thin Wire Deep Access

FS BONDTEC Series 5850 Heavy Ribbon

FS BONDTEC Series 5850 Heavy Ribbon

FS BONDTEC Series 5850 Heavy Wire

FS BONDTEC Series 5850 Heavy Wire

FS BONDTEC 5310 Manual Gold Ball Wire Bonder

FS BONDTEC 5310 Manual Gold Ball Wire Bonder

FS BONDTEC 5330 Thin Wire Wedge Bonder

FS BONDTEC 5330 Thin Wire Wedge Bonder

FS BONDTEC 5350 Heavy Wire Bondhead

FS BONDTEC 5350 Heavy Wire Bondhead

FS BONDTEC 53xx BDA Ball-Deep Access Bondhead

FS BONDTEC 53xx BDA Ball-Deep Access Bondhead

FS BONDTEC 5610 Gold Bonder

FS BONDTEC 5610 Gold Bonder

FS BONDTEC 56xx Semi-Automatic Wire Bonder

FS BONDTEC 56xx Semi-Automatic Wire Bonder