The 5600iC Pull & Shear Test Head transforms your 56xx Series bonder into a fully automated quality control station. This versatile attachment uses exchangeable cartridges to switch between various test modes, allowing for both destructive and non-destructive pull and shear testing of wire and ribbon bonds. The system is equipped with an integrated camera for automatic test point recognition and utilizes advanced analysis software to provide detailed statistical data and pass/fail reports. By integrating testing directly onto the bonding platform, manufacturers can significantly reduce part handling and ensure immediate feedback on process stability. This tester is an essential tool for facilities complying with MIL-STD-883 or similar high-reliability standards, offering the automated precision and data logging necessary for modern microelectronic quality management.
FS BONDTEC 5600iC Pull & Shear Tester
SKU: FSB-015
In Stock
Automated pull and shear test head for the 56xx series. Features exchangeable cartridges, camera-aided testing, and comprehensive analysis software for microelectronic quality control.