The 5380 DIE Bonder is a precision manual attachment for the Series 53xx platform, designed to handle delicate DIE-attachment processes with professional-grade accuracy. It features a $2 \times 2$ inch working area compatible with standard Waffle-packs, Gel-Packs, or specialized trays, making it highly versatile for various component sizes. The system utilizes a highly sensitive Touchdown-Detection mechanism and allows for fully programmable pickup and bond forces ranging from 5 to 500 cN, ensuring that even the most fragile semiconductor surfaces are handled without damage. This head is an ideal solution for R&D laboratories and low-volume production facilities that require the tactile control of a manual system combined with the electronic sophistication of programmable force profiles. Whether working on complex hybrids or simple sensor assemblies, the 5380 DIE Bonder provides a stable and repeatable platform for critical component placement.