The 5630 Thin Wire Wedge-Wedge Bondhead is a versatile exchangeable unit for the semi-automatic 56xx series, capable of bonding aluminum and gold wires from 17.5 to 75 µm. A standout feature of this head is the Deformation Limit Control (DLC) system, which provides real-time quality monitoring and process checks by measuring the actual deformation of the wire during the bond cycle. The head comes with a standard 45° wire guide that is easily convertible to 30° or 60° to accommodate complex component geometries and interference issues. Using 1″ tools and a high-precision digital ultrasonic generator, the 5630 ensures repeatable, high-strength bonds for aerospace and telecommunications hardware. This head offers the perfect balance of technical sophistication and ease of use, providing the automated data feedback necessary for maintaining high quality standards in a semi-automated production line.