Specifically engineered for constricted and difficult bonding geometries, the 5632 Deep Access Bondhead is an exchangeable unit for the 56xx semi-automatic series. This head features a unique 90° wire guide that allows for wedge-wedge bonding using 1″ or 3/4″ tools in deep-cavity packages or densely packed assemblies where standard 45° heads cannot reach. It is perfectly suited for handling both aluminum and gold wires from 17.5 to 75 µm, as well as thin aluminum and gold ribbons. The 5632’s design eliminates the risk of wire-to-component interference, making it the industry-standard choice for microwave modules and high-frequency RF packages. By providing a clear vertical path for the wire, this head ensures that bond placement remains accurate and consistent, even in the most restricted spaces of modern microelectronic housing designs.