The FSB-010 53XX BDA is a specialized Ball-Deep Access bondhead designed for the Series 53xx manual platform, enabling high-precision bonding in difficult and constricted geometries. This head features a unique 90° wire orientation for aluminum and gold wires ranging from 17.5 to 75 μm, making it ideal for deep-access wedge-wedge bonding using 1″ or 3/4″ tools. Additionally, it supports gold-ball bonding for wires up to 50 μm using standard 16-19mm capillaries. The BDA head is perfect for complex microwave packages, sensors, and components with high vertical walls where standard bondheads cannot reach. With a programmable Z-axis of 60mm and Y-axis of 25mm, this head provides the technical sophistication needed for specialized microelectronic assembly and is even retrofittable to the 5380 DIE-Bonder platform for expanded functionality.