The Tresky T-5100 is a universal micro-assembly workhorse, combining the tactile flexibility of a manual bonder with the precision of semi-automatic process capabilities. It is the preferred choice for R&D laboratories and pilot production lines due to its superb accuracy and repeatability, featuring a true linear Z-axis and high-resolution optics that allow for flip-chip placement with sub-micron accuracy. The T-5100 is incredibly intuitive to operate, typically requiring only minutes of training to begin high-precision work. The extremely rigid, compact machine base fits easily on a standard lab desk, while the “W” version supports up to a 200mm wafer table with an electronic die ejection system. Whether performing ultrasonic bonding, high-force attachment, or delicate eutectic processes, the T-5100 provides the stable, adaptable environment required for the most demanding micro-assembly and component placement tasks.