The Seamark X6600 and X5600 series are high-resolution, offline X-ray inspection systems designed for the deep-dive analysis of hidden solder joints, including BGAs, QFNs, and LGAs. The X6600 represents the higher-end platform with a larger stage and superior magnification for ultra-fine-pitch components, while the X5600 (recently commissioned for key Australian customers) offers a versatile and robust solution for standard high-reliability inspection. Both systems feature 90kV or 130kV closed X-ray tubes and high-definition flat-panel detectors to produce crystal-clear images of internal voids, bridging, and “head-in-pillow” defects. The integrated software includes powerful CNC automation and automated void calculation tools, making these machines essential for failure analysis and SMT process optimization. Their compact, lead-shielded design ensures operator safety while providing the hidden-detail visibility required for aerospace-grade quality assurance.