T-6000-L/G Flexible High Precision Automatic Die Bonder

The T-6000-L is fully automated all-purpose system built on a sophisticated granite gantry and high precision motion control system.

T-6000-L can be upgraded with new loader and unloader modules. and can be customized to suit all market needs.
This system offers our customers the opportunity to grow from a manual manufacturing process to a fully automated process.

• Adhesive Bonding
• Thermosonic Flip-Chip Bonding
• DIE Attach
• Flip Chip Bonding