• Wedge-wedge bonding using 1″ tools for aluminum and gold wires from 17,5 to 75 µm strength
  • 45° wire guide. convertible to 30° or 60° – depending on component geometry
  • Digital ultrasonice generator provides adjustable bond frequencies
  • Deformation Limit Control (DLC) for real-time quality check and process monitoring

 

Series 5830 Thin Wire Wedge-Wedge

SKU: _P-series-5830-thin-wire-wedge-wedge

In Stock

Exchangeable Bondhead 5830

SKU: _P-series-5830-thin-wire-wedge-wedge Categories:
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