The 5810 is a high-speed, fully automatic gold ball bondhead designed for the Series 58xx automatic platform. Engineered for high-throughput production, it handles gold wire from 17.5 to 50 µm with remarkable speed and precision. The head features a highly sensitive, contactless electronic touchdown sensor that allows for digitally controlled, programmable bond forces—critical for protecting delicate surfaces in high-speed automated cycles. Its digital ultrasonic generator provides adjustable bond frequencies to optimize the welding process for different materials. Capable of bumping, safety-bumping, and complex stitch-on-ball patterns, the 5810 utilizes standard 16-19 mm capillaries. This head is the centerpiece for fully automated microelectronic assembly lines, offering the extreme reliability and rapid cycle times required for mass-market LED and sensor manufacturing.